TC WAFER In Situ Wired Wafer Temperature Measurement

Instrumented wafers are used in semiconductor processing equipment where it is critical to understand and control the temperature at the wafer surface.

TC Wafer In Situ Wired Temperature Measurement Systems are commonly used for applications such as rapid thermal processing (RTP), rapid thermal annealing (RTA), post exposure bake (PEB), chemical vapor deposition (CVD), physical vapor deposition (PVD), ION implantation, solar cells and many other heat-driven processes.

Temperature acquisition Software

ZCDAQ TEMP accurately collects and analyzes wafer temperature data, provides multi-point temperature measurement solutions, visualizes temperature distribution and trend charts. ZCDAQ TEMP provides hardware and software embedded solutions that can measure wafers of any size and up to 68 channels of thermocouple inputs.

High Precision Temperature Modules

12-channel miniature socket temperature module

Features

• Miniature socket connection

• Maximum 12-channel thermocouple temperature measurement

• Channel independent switch control

• Operational failure indication

• RJ45, RS485, USB, Bluetooth communication ports

• Modbus communication protocol

• Support standard rail mounting

• Programmable module address, baud rate, network port, etc

• AC220V/DC24V power supply

17x4 D-sub connector temperature module

Features

• Integrated DB37 terminal connection

• Temperature measurement up to 68 channels

• Channel independent switch control

• Operational failure indication

• LAN, RS485, USB, Bluetooth communication ports

• Modbus communication protocol

• Support standard rail mounting

• Programmable module address, baud rate, network port, etc

• AC220V/DC24V power supply

Specifications